Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/235647
Kind Code:
A1
Abstract:
This electronic device 1 has a heatsink 73. The heatsink 73 receives heat from an integrated circuit 70. The integrated circuit 70 is covered with a first shield 71A. The first shield 71A has an opening 72A formed therein, through which the heatsink 73 comes into contact with the integrated circuit 70. A second shield 71B is for covering the first shield 71A and other electronic components. The second shield 71B also has an opening 72B formed therein, through which the heatsink 73 is brought into contact with the integrated circuit 70. The first shield 71A and the second shield 71B have disposed therebetween a shielding member 74A that serves as an electrically-conductive first connection member. The shielding member 74A fills up a gap between the first shield 71A and the second shield 71B. The second shield 71B and a bottom 732 of the heatsink 73 also have disposed therebetween a shielding member 74B that serves as an electrically-conductive second connection member.
Inventors:
TANAKA TETSUYA (JP)
TAMAKI YUTA (JP)
TAMAKI YUTA (JP)
Application Number:
PCT/JP2020/020164
Publication Date:
November 26, 2020
Filing Date:
May 21, 2020
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H01L23/00; H01L23/467; H05K7/20; H05K9/00
Foreign References:
| JP2001339194A | 2001-12-07 | |||
| JP2006513556A | 2006-04-20 | |||
| JP2005294342A | 2005-10-20 | |||
| JP2017135368A | 2017-08-03 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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