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Patent Searching and Data


Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/002374
Kind Code:
A1
Abstract:
In the present invention, a circuit substrate (3) comprises: first and second rigid parts (11, 12) having six metal foil layers; and a thin flexible part (13) having two metal foil layers connecting the two rigid parts. Ground wiring (51) which is shaped like a wide strip is formed on the surface metal foil layer. A plurality of inter-rigid-part wirings (55) are formed on the inner metal foil layer in parallel lines. Outer edges (51a) of the ground wiring (51) are located closer to the side edges (13a) of the flexible part (13) than to the inter-rigid-part wirings (55). The ground wiring (51) protects the inter-rigid-part wirings (55) from cracks.

Inventors:
HARA, Hideyuki (JP)
KANAZAWA, Takuro (JP)
YAMADA, Narutoshi (JP)
Application Number:
JP2020/025756
Publication Date:
January 07, 2021
Filing Date:
July 01, 2020
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS, LTD. (JP)
International Classes:
B62D5/04; H05K1/02; H05K1/14
Attorney, Agent or Firm:
KOBAYASHI, Hiromichi et al. (JP)
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