Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/127432
Kind Code:
A1
Abstract:
The present application relates to the technical field of heat dissipation. Disclosed is an electronic device. The electronic device comprises a heat dissipation housing (1), a circuit board (2), a chip (3), a thermal interface material layer (4), a heat conduction member (5), and an elastic member (6); the circuit board (2), the chip (3), the heat conduction member (5), and the elastic member (6) are located in a cavity (101) formed by the heat dissipation housing (1); the chip (3) is located on the surface of the circuit board (2); the heat conduction member (5) is located on the surface of the chip (3); the elastic member (6) having heat transferability is compressed between the heat conduction member (5) and a first housing wall (11), so as to reduce a gap between the chip (3) and the heat conduction member (5); and the gap is filled with the thermal interface material layer (4). A thin thermal interface material layer (4) is filled in the gap, so that the heat transfer between the chip (3) and the heat conduction member (5) can be accelerated, and the heat conduction member (5) can quickly transfer the absorbed heat to the heat dissipation housing (1), thereby enhancing a heat dissipation effect.
Inventors:
PENG YAOFENG (CN)
Application Number:
PCT/CN2021/129084
Publication Date:
June 23, 2022
Filing Date:
November 05, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN210325761U | 2020-04-14 | |||
| CN101989585A | 2011-03-23 | |||
| US5396403A | 1995-03-07 | |||
| US20170053845A1 | 2017-02-23 | |||
| CN202011478901A | 2020-12-15 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: