Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/176563
Kind Code:
A1
Abstract:
An electronic device (1) according to the present disclosure is provided with a semiconductor substrate (2), a chip (3), bumps (4, 4a), and a side wall portion (5, 5a). The bumps (4, 4a) connect a plurality of connection pads (21, 31) provided on opposite main surfaces of the semiconductor substrate (2) and the chip (4, 4a). The side wall portion (5, 5a) includes a porous metal layer (41, 51) annularly surrounding a region in which a plurality of bumps (4, 4a) are provided, and connects the semiconductor substrate (2) and the chip (3). The chip (3) has a thermal expansion coefficient differing from that of the semiconductor substrate by 0.1 ppm/℃ or more. The chip (3) comprises a semiconductor laser, and the semiconductor substrate (2) includes a drive circuit for driving the semiconductor laser.
Inventors:
IMAHIGASHI TAKASHI (JP)
Application Number:
PCT/JP2022/003199
Publication Date:
August 25, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60
Domestic Patent References:
| WO2020162142A1 | 2020-08-13 | |||
| WO2011114751A1 | 2011-09-22 |
Foreign References:
| JPH0637143A | 1994-02-10 | |||
| JP2011216475A | 2011-10-27 | |||
| JP2014090098A | 2014-05-15 | |||
| JPH11168116A | 1999-06-22 | |||
| US20160300808A1 | 2016-10-13 | |||
| JP2018160589A | 2018-10-11 | |||
| JP2010278139A | 2010-12-09 | |||
| JP2003174055A | 2003-06-20 | |||
| JP2000077458A | 2000-03-14 | |||
| JP2013098514A | 2013-05-20 | |||
| JP2004214469A | 2004-07-29 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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