ELECTRONIC DEVICE

WIPO Patent Application WO/2023/010915

A1

The present application provides an electronic device, comprising a circuit board, a chip, a radiator, and a limiting member. The chip is fixed to the circuit board, and the side facing away from the circuit board forms a first heat dissipation surface. The radiator is mounted on the circuit board, the side facing the circuit board forms a second heat dissipation surface, and a heat dissipation medium is provided between the second heat dissipation surface and the first heat dissipation surface of the chip. The limiting member is disposed on one of the radiator and the circuit board, and forms a gap with the other. Since the radiator is not carried on the limiting member and has a certain gap with the limiting member, the second heat dissipation surface presses against the first heat dissipation surface when acting on the first heat dissipation surface, so that the first heat dissipation surface and the second heat dissipation surface can be arranged very close to each other, thereby reducing the amount of the heat dissipation medium between the first heat dissipation surface and the second heat dissipation surface, and thus improving the heat dissipation efficiency of the chip. When the radiator is relatively close to the chip, the limiting member can limit the movement of the radiator, thereby effectively protecting the chip.

CUI CHANGZHI (CN)
XIE JUNQING (CN)
WANG XUECHENG (CN)

PCT/CN2022/090956

February 09, 2023

May 05, 2022

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HUAWEI TECH CO LTD (CN)

H01L23/367; H01L23/40; H05K7/20

CN108598048A	2018-09-28
CN212749761U	2021-03-19
CN102709262A	2012-10-03
CN112788911A	2021-05-11
CN210328135U	2020-04-14

SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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