Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199607
Kind Code:
A1
Abstract:
Provided is an electronic device that increases the degree of freedom in layout for electronic components on a circuit board and is capable of suppressing noise leakage. A heat pipe (50, 150) passes through an opening (32, 132) formed in an upper substrate shield (30, 130) and extends on the outside of the upper substrate shield. An auxiliary shield (80, 180) is attached to the upper substrate shield (30, 130) and covers the opening (32, 132) in the upper substrate shield (30, 130).
Inventors:
MORISHITA MITSUHARU (JP)
SUGAWARA NOBUYUKI (JP)
YANAGIHARA HISAO (JP)
NOZAWA TETSUFUMI (JP)
SUGAWARA NOBUYUKI (JP)
YANAGIHARA HISAO (JP)
NOZAWA TETSUFUMI (JP)
Application Number:
PCT/JP2023/006290
Publication Date:
October 19, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H05K9/00; H01L23/427; H05K7/20
Domestic Patent References:
| WO2021193621A1 | 2021-09-30 |
Foreign References:
| JP2004055862A | 2004-02-19 | |||
| JP2019212832A | 2019-12-12 | |||
| JP2017188601A | 2017-10-12 | |||
| US20170242462A1 | 2017-08-24 | |||
| JPH0730271A | 1995-01-31 | |||
| US20170238442A1 | 2017-08-17 | |||
| CN205738119U | 2016-11-30 | |||
| US9698132B1 | 2017-07-04 | |||
| JP2016066119A | 2016-04-28 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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