Title:
ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199752
Kind Code:
A1
Abstract:
The present invention provides an electronic device in which the cost of a circuit board can be reduced. A storage medium (100) for connecting to a connector (3c) mounted on an upper surface (20U) of a circuit board (20) is supported by a support structure (5) at a reverse-side end part (100R) of the storage medium (100). A lower-side board shield (40), which is a member different from the circuit board, is electrically connected to a ground unit provided to the end part of the storage medium via the support structure.
Inventors:
TSUCHIDA SHINYA (JP)
Application Number:
PCT/JP2023/013180
Publication Date:
October 19, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
SONY INTERACTIVE ENTERTAINMENT INC (JP)
International Classes:
H05K9/00; G06F1/18; H01R12/73; H01R13/6594
Foreign References:
| JPH01273392A | 1989-11-01 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
Download PDF:
Previous Patent: LAYERED BODY AND PACKAGING MATERIAL
Next Patent: GAS-BARRIER LAMINATE, PACKAGING FILM, PACKAGING CONTAINER, AND PACKAGED PRODUCT
Next Patent: GAS-BARRIER LAMINATE, PACKAGING FILM, PACKAGING CONTAINER, AND PACKAGED PRODUCT