Title:
ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/151304
Kind Code:
A1
Abstract:
The present invention has: a first substrate having a first main surface, and having an electronic element mounting part, which has a rectangular shape, is located on the first main surface, is composed of an insulator, and has one longitudinal end located on an outer edge section of the first main surface; a second substrate which is located on a second main surface on the reverse side from the first main surface, and has a third main surface facing the second main surface and a fourth main surface on the reverse side from the third main surface; and a third substrate which is embedded in the second substrate, composed of a carbon material, and has a fifth main surface located on the third main surface side in the thickness direction and a sixth main surface on the reverse side from the fifth main surface. In a planar perspective view, the thermal conduction of the third substrate in the longitudinal direction of the mounting part is greater than the thermal conduction of the third substrate in a direction orthogonal to the longitudinal direction of the mounting part.
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Inventors:
MORITA YUKIO (JP)
KITAZUMI NOBORU (JP)
MORIYAMA YOUSUKE (JP)
KITAZUMI NOBORU (JP)
MORIYAMA YOUSUKE (JP)
Application Number:
PCT/JP2019/003113
Publication Date:
August 08, 2019
Filing Date:
January 30, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01L23/36; H05K1/02; H05K1/03
Foreign References:
| JP2015191950A | 2015-11-02 | |||
| JP2012238733A | 2012-12-06 | |||
| JP2011023670A | 2011-02-03 | |||
| JP2009094213A | 2009-04-30 | |||
| JP2013175508A | 2013-09-05 |
Other References:
See also references of EP 3748671A4
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