Title:
ELECTRONIC ELEMENT SEALING BODY
Document Type and Number:
WIPO Patent Application WO/1995/002902
Kind Code:
A1
Abstract:
An electronic element sealing body which has excellent moisture resistance and soldering heat resistance and in which an electronic element is sealed with a synthetic resin wherein at least the extending parts of the lead wires are sealed with a heat resistance composition containing (A) a thermoplastic norbornane resin and (B) heat-resistant resin whose heat deformation temperature is 180 �C. An electronic element sealing body which has a transparent sealing part and a heat resistant sealing part, wherein the main body section of the electronic element is sealed with a thermoplastic norbornane resin and the extending parts of the lead wires are sealed with the above-mentioned heat-resistant composition.
Inventors:
KOUSHIMA YUJI (JP)
KOHARA TEIJI (JP)
NATSUUME TADAO (JP)
KOHARA TEIJI (JP)
NATSUUME TADAO (JP)
Application Number:
PCT/JP1994/001157
Publication Date:
January 26, 1995
Filing Date:
July 14, 1994
Export Citation:
Assignee:
NIPPON ZEON CO (JP)
KOUSHIMA YUJI (JP)
KOHARA TEIJI (JP)
NATSUUME TADAO (JP)
KOUSHIMA YUJI (JP)
KOHARA TEIJI (JP)
NATSUUME TADAO (JP)
International Classes:
C08L65/00; H01B3/30; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08L65/00; H01L33/00
Foreign References:
| JPH03281564A | 1991-12-12 | |||
| JPH0551437A | 1993-03-02 | |||
| JPH0649182A | 1994-02-22 |
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