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Title:
ELECTRONIC ENDOSCOPE ILLUMINATION SYSTEM, ASSEMBLY METHOD AND ALUMINUM SUBSTRATE FOR SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/202472
Kind Code:
A1
Abstract:
An aluminum substrate (1) for an electronic endoscope illumination system, the aluminum substrate comprising a positive bonding pad (10), a negative bonding pad (11), an LED lamp positive and negative bonding pad (12), an LED lamp positive and negative bonding pad silk screen (13), a first copper clad (14), a second copper clad (14-1), a positive copper clad (15) and a negative copper clad (15-1), wherein the first copper clad (14) and the second copper clad (14-1) are each arranged on a surface of the aluminum substrate (1) separately, the positive bonding pad (10) and the negative bonding pad (11) are separately connected to the first copper clad (14) and the second copper clad (14-1) by means of the positive copper clad (15) and the negative copper clad (15-1) respectively, the positive bonding pad (10) is connected to an LED lamp positive lead wire, and the negative bonding pad (11) is connected to an LED lamp negative wire; and the LED lamp positive and negative bonding pad (12) is mounted in the middle of the aluminum substrate (1) and is used for mounting an LED lamp, and the LED lamp positive and negative bonding pad silk screen (13) is arranged around the LED lamp positive and negative bonding pad (12). Further provided are an illumination system and an assembly method. A distance between an end surface of an optical fiber light guide beam (54) and a light-emitting surface of the LED lamp is fixed by means of a combination of a radiator (2) and a spacer ring (3), thereby reducing the assembly difficulty, and ensuring the production consistency.

Inventors:
TANG HAITAO (CN)
FENG LUHENG (CN)
DING WENLONG (CN)
ZHANG CHENG (CN)
Application Number:
PCT/CN2023/088246
Publication Date:
October 26, 2023
Filing Date:
April 14, 2023
Export Citation:
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Assignee:
SUZHONG PHARMACEUTICAL GROUP MEDICAL EQUIPMENT CO LTD (CN)
International Classes:
A61B1/07; B23K1/00
Foreign References:
CN114748021A2022-07-15
CN209298156U2019-08-23
JP2012200442A2012-10-22
CN209884096U2020-01-03
CN112289782A2021-01-29
CN103162110A2013-06-19
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