Title:
ELECTRONIC EQUIPMENT HOUSING AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/130684
Kind Code:
A1
Abstract:
[Problem] To provide an electronic equipment housing including a rolled junction having a plurality of different types of metal plates joined together by rolling and a method for manufacturing the electronic equipment housing, the electronic equipment housing being capable of being wirelessly charged and satisfying various characteristics such as high strength and light weight. [Solution] An electronic equipment housing of the present invention is composed of a rolled junction comprising two or more different types of metal layers, and includes an outer frame surrounding sides of a display panel and a rear panel of electronic equipment, and an intermediate board connected to the outer frame so that the intermediate board is disposed between the display panel and the rear panel, the intermediate board being composed of at least one metal layer.
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Inventors:
HASHIMOTO YUSUKE (JP)
SADAKI KOTA (JP)
KUROKAWA TEPPEI (JP)
SADAKI KOTA (JP)
KUROKAWA TEPPEI (JP)
Application Number:
PCT/JP2018/034997
Publication Date:
July 04, 2019
Filing Date:
September 21, 2018
Export Citation:
Assignee:
TOYO KOHAN CO LTD (JP)
International Classes:
H05K5/02; B21D51/18; B21D53/00; B32B15/08
Domestic Patent References:
| WO2017057665A1 | 2017-04-06 |
Foreign References:
| JP2012215682A | 2012-11-08 | |||
| JP3092598U | 2003-03-20 | |||
| JP2003051681A | 2003-02-21 | |||
| US20150003011A1 | 2015-01-01 | |||
| JP2013219517A | 2013-10-24 | |||
| JP2017229144A | 2017-12-28 |
Attorney, Agent or Firm:
OHTA PATENT OFFICE (JP)
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