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Patent Searching and Data


Title:
ELECTRONIC EXPANSION VALVE AND THERMAL MANAGEMENT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2021/233326
Kind Code:
A1
Abstract:
The present invention relates to an electronic expansion valve and a thermal management assembly. In the present invention, since a refrigerant sensor is tightly pressed on a housing assembly, the refrigerant sensor has high stability after being mounted on the electronic expansion valve and is not prone to loosening. The electronic expansion valve provided in the present invention has the advantage of the refrigerant sensor being stably mounted. The thermal management assembly provided in the present invention comprises the electronic expansion valve.

Inventors:
WAN XUANCHEN (CN)
LI QING (CN)
ZHANG JUNXIN (CN)
Application Number:
PCT/CN2021/094544
Publication Date:
November 25, 2021
Filing Date:
May 19, 2021
Export Citation:
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Assignee:
VALEO AUTOMOTIVE AIR CONDITIONING HUBEI CO LTD (CN)
International Classes:
F25B41/31; F16K11/07; F16K31/06; F25B49/02
Foreign References:
CN212746975U2021-03-19
CN212692177U2021-03-12
CN213335059U2021-06-01
CN213335060U2021-06-01
CN108869830A2018-11-23
CN110953390A2020-04-03
CN110735958A2020-01-31
KR20190009053A2019-01-28
CN101551174A2009-10-07
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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