Title:
ELECTRONIC INTERCONNECT DEVICES
Document Type and Number:
WIPO Patent Application WO2005084183
Kind Code:
A3
Abstract:
An improved method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes non-conducting through exposure to electromagnetic radiation. The conducting material generally comprises single-wall carbon nanotubes.
Inventors:
CULLEN DONALD P
Application Number:
PCT/US2004/004748
Publication Date:
November 24, 2005
Filing Date:
February 17, 2004
Export Citation:
Assignee:
MACDERMID INC (US)
International Classes:
H01L51/30; H01L51/40; H05K1/03; H05K3/02; H05K3/10; (IPC1-7): H01L51/40; H01L51/00; H01L35/24
Foreign References:
| US6057637A | 2000-05-02 |
Other References:
See also references of EP 1634342A4
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