ELECTRONIC MEMBER REMOVAL METHOD AND DEVICE THEREFOR

WIPO Patent Application WO/2021/111538

A1

Provided is technology capable of removing an electronic member from a circuit board even when the area of a metal terminal is small. A plurality of electronic components 20 are joined to a circuit board 10 by means of solder 30. This device comprises: a suction means 60 that includes a suction nozzle 50 having a hollow 51 and that suctions an electronic component 20 to the tip end of the suction nozzle; a heating means 70 that includes a heating element 71 provided to the lower part of the suction nozzle and that heats the heating element 71 by electromagnetic induction heating; and a conduction means 50 that conducts the heat generated by the heating element 71 to the tip end of the suction nozzle 50. The heat is conducted from the heating element 71, through the nozzle 50, and to the electronic component 20 and the solder 30. This melts the solder 30 and releases the bond between a circuit-side terminal 12 and an electronic component-side terminal 21. Meanwhile, the suction state between the electronic component 20 and the nozzle 50 is maintained, and the electronic component 20 can be removed from the circuit board 10 when the nozzle 50 is separated from the circuit board 10.

SUGIYAMA KAZUHIRO (JP)
SATO AKIRA (JP)
FUKUDA KOKI (JP)

PCT/JP2019/047349

June 10, 2021

December 04, 2019

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WONDER FUTURE CORP (JP)

H05K3/34

WO2019108006A1

2019-06-06

JPH09330956A	1997-12-22
JP2007510548A	2007-04-26
JPS6448669A	1989-02-23
JP2001298268A	2001-10-26
JP2009200170A	2009-09-03
JP2009164310A	2009-07-23
KR20160129570A	2016-11-09
JPS5793175U	1982-06-08
JPS5765771U	1982-04-20

MAEJIMA Daigo et al. (JP)

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