Title:
ELECTRONIC MODULE, ELECTRONIC DEVICE, AND MANUFACTURING METHODS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/188955
Kind Code:
A1
Abstract:
An electronic module (10) comprises: a resin molded body (12); a wiring circuit (30) formed on an upper surface (121) of the resin molded body (12); and a contact pin (20) for electrically connecting the wiring circuit (30) to an external circuit. The contact pin (20) includes a rod-shaped section (21), and a protruding structure section (22) that protrudes from a peripheral surface of the rod-shaped section (21). The contact pin (20) is embedded in the resin molded body (12) such that a portion of the rod-shaped section (21) protrudes from the resin molded body (12), and such that an upper surface (23) that is a surface of the protruding structure section (22) is exposed at the upper surface (121). The wiring circuit (30) is also formed on the upper surface (23) of the protruding structure section (22). As a result of the above, it is possible to provide an electronic module with high connection reliability between a contact pin and a wiring circuit.
Inventors:
KAWAI WAKAHIRO (JP)
Application Number:
PCT/JP2020/000052
Publication Date:
September 24, 2020
Filing Date:
January 06, 2020
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01L23/12; H01L21/56; H01L23/28; H01L25/04; H01L25/18; H05K1/11; H05K1/14; H05K3/00; H05K3/40
Foreign References:
| JP2009059812A | 2009-03-19 | |||
| JP2006156435A | 2006-06-15 | |||
| JPH02106094A | 1990-04-18 | |||
| JP2009267050A | 2009-11-12 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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