Title:
ELECTRONIC MODULE HAVING A GROOVE ANCHORING TERMINAL PINS
Document Type and Number:
WIPO Patent Application WO/2022/183526
Kind Code:
A1
Abstract:
A module has electronic components mounted to a Printed Circuit Board (PCB) with multiple patterned conductive layers connecting to conductive slot metal around a conductive slot. A groove is cut through a top molding encapsulant above and into the conductive slot but does not cut through a bottom molding encapsulant. A terminal pin is inserted into the groove and pushed down into the conductive slot. When heated, embedded solder previously applied to the conductive slot metal flows between the end of the terminal pin and the conductive slot metal to form a solder bond. An end of the PCB past the conductive slot has no metal traces, preventing shorts. Epoxy can be placed into the groove around the terminal pin or a hole formed in the terminal pin to increase strength of the anchored terminal pin. The molding around the groove protects terminal pins from shorting from the side.
Inventors:
OLLERES LOURDITO (CN)
CHOW SHI WO (CN)
CHOW SHI WO (CN)
Application Number:
PCT/CN2021/080827
Publication Date:
September 09, 2022
Filing Date:
March 15, 2021
Export Citation:
Assignee:
HONG KONG APPLIED SCIENCE & TECH RESEARCH INST CO LTD (CN)
International Classes:
H01L23/31; H01L23/488
Foreign References:
| CN107170718A | 2017-09-15 | |||
| CN105609473A | 2016-05-25 | |||
| EP3770959A1 | 2021-01-27 | |||
| CN101488495A | 2009-07-22 | |||
| US20070238324A1 | 2007-10-11 |
Attorney, Agent or Firm:
IDEA INTELLECTUAL (SHENZHEN) IP AGENCY (CN)
Download PDF: