Title:
ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/194062
Kind Code:
A1
Abstract:
The present invention comprises: a substrate 12 having flexibility and electrical insulation properties; and a circuit unit 15 obtained by mounting an electronic device 14 on a wiring pattern 13 formed on at least one surface of the substrate 12. A resin body 16 obtained by sealing the circuit unit 15 with an electrically insulative resin is provided. The substrate 12 has flexibility so as to be deformable by pressure applied when sealing is performed using the electrically insulative resin. The substrate 12 is made of a breathable material. The wiring pattern 13 is a metal foil on which soldering can be performed. The metal foil is a material having a recrystallization temperature or a melting point equal to or lower than the molding temperature when the circuit unit 15 is sealed with the electrically insulative resin. The present invention comprises: a circuit unit forming step for forming the circuit unit 15 by mounting the electronic device 14; and a sealing step for sealing the circuit unit 15 with the resin body 16 made from the electrically insulative resin.
Inventors:
WATANUKI OSAMU (JP)
HONDA KENICHI (JP)
SHINOHARA ORIE (JP)
ISHIKAWA AKIRA (JP)
ISHIKAWA TSUTOMU (JP)
HONDA KENICHI (JP)
SHINOHARA ORIE (JP)
ISHIKAWA AKIRA (JP)
ISHIKAWA TSUTOMU (JP)
Application Number:
PCT/JP2018/015881
Publication Date:
October 25, 2018
Filing Date:
April 17, 2018
Export Citation:
Assignee:
TATEYAMA KAGAKU IND CO LTD (JP)
International Classes:
H01L23/28; H01L23/12; H01L23/14; H05K1/18; H05K3/28
Domestic Patent References:
| WO2012049898A1 | 2012-04-19 |
Foreign References:
| JP2016092261A | 2016-05-23 | |||
| JPH09121090A | 1997-05-06 |
Other References:
See also references of EP 3564991A4
Attorney, Agent or Firm:
HIROSAWA Isao (JP)
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