ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Title:

ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO/2019/053840

Kind Code:

A1

Abstract:

This electronic module has: a first substrate 11; electronic elements 13, 23, which are provided on one side of the first substrate 11; a second substrate 21 that is provided on one side of the electronic elements 13, 23; a first connecting body 210 that is provided between the first substrate 11 and the second substrate 21; a second connecting body 220, which is provided between the first substrate 11 and the second substrate 21, and which has a length that is shorter than that of the first connecting body 210; and a sealing section 90 that seals at least the electronic elements. The first connecting body 210 is not electrically connected to the electronic elements, and the second connecting body 220 is electrically connected to the electronic elements 13, 23.

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Inventors:

MATSUZAKI OSAMU (JP)
IKEDA KOSUKE (JP)

Application Number:

PCT/JP2017/033267

Publication Date:

March 21, 2019

Filing Date:

September 14, 2017

Export Citation:

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Assignee:

SHINDENGEN ELECTRIC MFG (JP)

International Classes:

H05K3/46; H05K1/02

Foreign References:

JP2009176947A	2009-08-06
JP2016048728A	2016-04-07
JP2016529716A	2016-09-23
JP2015015302A	2015-01-22
JP2001267714A	2001-09-28

Attorney, Agent or Firm:

OHNO Seiji et al. (JP)

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