Title:
ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/166567
Kind Code:
A1
Abstract:
The present invention suppresses a decrease in the electrical characteristics of an electronic element. A high frequency module (1), which is an electronic module, comprises a semiconductor element (2), a first insulating layer (3), an acoustic wave element (4) that is an electronic element having electrical characteristics, and a second insulating layer (5), said module (1) further comprising a first intermediate layer (6) and a second intermediate layer (7). The first intermediate layer (6) is interposed between the acoustic wave element (4) and the semiconductor element (2), and has a thermal conductivity that is less than that of the first insulating layer (3) and the second insulating layer (5). The second intermediate layer (7) is interposed between the first insulating layer (3) and the second insulating layer (5), and has a thermal conductivity that is less than that of the first insulating layer (3) and the second insulating layer (5). There is a difference in level between a first main surface (31), of the first insulating layer (3), that is in contact with the second intermediate layer (7), and one main surface (21), of the semiconductor element (2), that is in contact with the first intermediate layer (6). In a thickness direction (D1) of the first insulating layer (3), a distance (L1) between the first main surface (31) and a second main surface (32) of the first insulating layer (3) is longer than a distance (L2) between the second main surface (32) of the first insulating layer (3) and the one main surface (21) of the semiconductor element (2).
Inventors:
IWAMOTO TAKASHI
Application Number:
PCT/JP2020/005161
Publication Date:
August 20, 2020
Filing Date:
February 10, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/31; H01L23/29; H01L25/10; H01L25/11; H01L25/18; H03H9/25
Foreign References:
| JP2016213466A | 2016-12-15 | |||
| US20180053745A1 | 2018-02-22 | |||
| US20110278741A1 | 2011-11-17 | |||
| JP2010056842A | 2010-03-11 | |||
| JP2010153941A | 2010-07-08 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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