Title:
ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2018/109820
Kind Code:
A1
Abstract:
This electronic module has: a sealing section 90; electronic elements 15, 25 that are provided in the sealing section 90; rear surface-exposed conductive bodies 10, 20, 30 having rear surface-exposed sections 12, 22, 32, the rear surfaces of which are exposed from the sealing section 90, and one group of end terminal sections 11, 21, 31, which extend from the rear surface-exposed sections 12, 22, 32, and which protrude toward the outside from the side surface of the sealing section 90; and rear surface-unexposed conducive bodies 40, 50 having unexposed sections 42, 52 sealed in the sealing section 90, and the other group of terminal sections 41, 51, which extend from the unexposed sections 42, 52, and which protrude toward the outside from the side surface of the sealing section 90. The electronic elements 15, 25 are placed on the rear surface-exposed sections 12, 22, 32, and the terminal sections 41, 51 have a width that is smaller than that of the terminal sections 11, 21, 31.
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Inventors:
KAMIYAMA YOSHIHIRO (JP)
Application Number:
PCT/JP2016/086997
Publication Date:
June 21, 2018
Filing Date:
December 13, 2016
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG (JP)
International Classes:
H01L23/48; H01L23/28; H01L23/29; H01L25/07; H01L25/18
Foreign References:
| JP2014139968A | 2014-07-31 | |||
| JP2014047362A | 2014-03-17 | |||
| JP2016076563A | 2016-05-12 |
Attorney, Agent or Firm:
OHNO, Seiji et al. (JP)
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