Title:
ELECTRONIC PACKAGE, DISPLAY DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/021200
Kind Code:
A1
Abstract:
Provided is an electronic package wherein a built-in chassis (CS) and an FPC substrate (11) including a ground pattern (12) are mounted on a front bezel (BZ1) and a back bezel (BZ2) formed of a conductive material. A ground pattern (12) is arranged between the back bezel (BZ2) and the built-in chassis (CS), and the back bezel (BZ2) includes a claw section (22) for pressing the ground pattern (12) to the built-in chassis (CS). The claw section (22) has elasticity when the claw section is in a linear state, and presses the ground pattern (12) by a leading end (22T) formed by bending an outer periphery.
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Inventors:
YOKONUMA SHINSUKE
Application Number:
PCT/JP2009/061372
Publication Date:
February 25, 2010
Filing Date:
June 23, 2009
Export Citation:
Assignee:
SHARP KK (JP)
YOKONUMA SHINSUKE
YOKONUMA SHINSUKE
International Classes:
G09F9/00; G02F1/1333; H05K1/02; H05K7/14
Foreign References:
| JP2001075077A | 2001-03-23 | |||
| JP2001326006A | 2001-11-22 | |||
| JP2001265239A | 2001-09-28 | |||
| JP2008181066A | 2008-08-07 | |||
| JPS63287884A | 1988-11-24 | |||
| JP2006350243A | 2006-12-28 |
Other References:
See also references of EP 2315195A4
Attorney, Agent or Firm:
SANO SHIZUO (JP)
Shizuo Sano (JP)
Shizuo Sano (JP)
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