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Patent Searching and Data


Title:
ELECTRONIC PART, ELEMENT PACKAGE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/058834
Kind Code:
A1
Abstract:
Provided are an electronic part and an element package having high airtightness, wherein processes are made to be simple and productivity is improved in the manufacturing method thereof. The electronic part has an element and a package that houses the element. The package comprises a ceramic substrate, a lid body, and a connection member that connects the ceramic substrate and the lid body. A section of the lid body that joins together with the connection member is comprised of metal, the connection member is comprised of a metal having aluminum as its main ingredient, and is joined directly together with the ceramic substrate, and the element is anchored to the ceramic substrate or the lid body.

Inventors:
HORIKAWA KEIJI (JP)
Application Number:
PCT/JP2010/067366
Publication Date:
May 19, 2011
Filing Date:
October 04, 2010
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
HORIKAWA KEIJI (JP)
International Classes:
H01G4/224; H01G11/78; H01G11/80; H01G11/84; H01M50/103; H01M50/117; H01M50/119
Foreign References:
JP2005123154A2005-05-12
JPH10125824A1998-05-15
JP2006028018A2006-02-02
JP2008098462A2008-04-24
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