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Patent Searching and Data


Title:
ELECTRONIC PART AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/111625
Kind Code:
A1
Abstract:
Provided are an electronic part for which whisker-inhibiting ability in terms of whisker length is dramatically increased, and a manufacturing method therefor. An electronic part having an electronic part element on which external electrodes are formed, Ni-plating films formed on the external electrodes, and Sn-plating films formed so as to cover the Ni-plating films. The electronic part is characterized in that: flake-shaped Sn-Ni alloy particles are formed in the Sn-plating film; the flake-shaped Sn-Ni alloy particles are present in the area from the surface of the Sn-plating film on the Ni-plating film side to 50% or less of the thickness of the Sn-plating film; and when Sn is removed from the Sn-plating film to leave only the flake-shaped Sn-Ni alloy particles and the surface with the flake-shaped Sn-Ni alloy particles revealed by removing the Sn is viewed in plan view, the area occupied by the flake-shaped Sn-Ni alloy particles is in the range of 15% - 60% of the observed surface area.

Inventors:
SAITO AKIRA (JP)
OGAWA MAKOTO (JP)
MOTOKI AKIHIRO (JP)
Application Number:
JP2013/050388
Publication Date:
August 01, 2013
Filing Date:
January 11, 2013
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C25D7/00; C25D5/12; C25D5/50; H01G4/12; H01G4/232; H01G4/30
Domestic Patent References:
WO2006134665A12006-12-21
Foreign References:
JP2001335987A2001-12-07
JP2006249460A2006-09-21
JP2009052076A2009-03-12
Attorney, Agent or Firm:
OKADA, MASAHIRO (JP)
Zenkei Okada (JP)
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Claims: