Title:
ELECTRONIC PART AND METHOD OF MANUFACTURE THEREOF
Document Type and Number:
WIPO Patent Application WO/2013/121689
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain an electronic part that is not liable to malfunction even when thermal shock is applied thereto repeatedly, such as in a thermal shock test. In this electronic part (1), an electronic part element (3) is mounted on a ceramic substrate (2) with a gap (A) therebetween, and a resin sealing layer (6) is disposed on the ceramic substrate (2) so as to seal the electronic part element (3). The resin sealing layer (6) comprises a first resin sealing layer (6a) that is provided so as to cover the electronic part element (3) along with the gap (A), and a second resin sealing layer (6b) that is positioned on top of the first resin sealing layer (6a). The linear thermal expansion coefficient of the second resin sealing layer (6b) is lower than the linear thermal expansion coefficient of the first resin sealing layer (6a).
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Inventors:
SHINKAI HIDEKI (JP)
YOSHIDA KAZUHIRO (JP)
YOSHIDA KAZUHIRO (JP)
Application Number:
PCT/JP2012/083868
Publication Date:
August 22, 2013
Filing Date:
December 27, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/29; H01L21/56; H01L23/31; H03H3/08; H03H9/02; H03H9/25
Domestic Patent References:
| WO2005071731A1 | 2005-08-04 |
Foreign References:
| JP2006245989A | 2006-09-14 | |||
| JP2004327623A | 2004-11-18 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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Claims: