ELECTRONIC PART TAPING PACKAGING COVER TAPE

Title:

ELECTRONIC PART TAPING PACKAGING COVER TAPE

Document Type and Number:

WIPO Patent Application WO/2004/094258

Kind Code:

A1

Abstract:

An electronic part taping packaging cover tape for heat-sealing a carrier tape storing electronic parts. The electronic part taping packaging cover tape comprises a base material film layer, a soft material layer, and a heat bonding layer. The soft material layer is made of metallocene straight-chain low density polyethylene, which has a specific gravity of 0.888-0.907.

Inventors:

FUJII KAZUHITO (JP)
KATOU SHINNICHI (JP)

Application Number:

PCT/JP2004/005981

Publication Date:

November 04, 2004

Filing Date:

April 26, 2004

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD (JP)
FUJII KAZUHITO (JP)
KATOU SHINNICHI (JP)

International Classes:

B65D73/02; C09J7/29; (IPC1-7): B65D65/40; B65D73/02; B32B27/32

Foreign References:

JPH08258888A	1996-10-08
JP2003012027A	2003-01-15
JP2002012288A	2002-01-15
JPH09175592A	1997-07-08
JPH10166523A	1998-06-23
JPH09201922A	1997-08-05

Attorney, Agent or Firm:

Yoshitake, Kenji (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)

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