ELECTRONIC PART

WIPO Patent Application WO/2012/124561

A1

Provided is an electronic part, wherein reliability of electrical connections between side face conductors and main-face conductors can be improved without forming a cover layer. The electronic part is provided with: (a) a main body (12) comprising a plurality of insulation layers (12p-12w) laminated together; (b) main-face conductors (16a/16b) formed on at least one main face (12a/12b) at one side in the laminating direction of the main body (12); (c) side face conductors (14) that penetrate insulation layers (12q-12v), that are exposed at the outer circumference end faces of the insulation layers (12q-12v), and that are formed continuously so as to reach insulation layers (12p, 12w) on which the main-face conductors (16a, 16b) are formed; and (d) outermost conductors (14a, 14b) that penetrate the insulation layers (12p, 12w) on which the main-face conductors (16a, 16b) are formed, and at least portions of which are arranged more to the inner side of the main body (12) than the side face conductors (14), when viewed from the laminating direction. The main-face conductors (16a, 16b) and the side face conductors (14) are electrically connected with the outermost conductors (14a, 14b) interposed therebetween.

OTUBO YOSHIHITO (JP)

PCT/JP2012/055786

September 20, 2012

March 07, 2012

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MURATA MANUFACTURING CO (JP)
OTUBO YOSHIHITO (JP)

H01F17/00; H01G4/40

WO2009147899A1

2009-12-10

JPH10208941A	1998-08-07
JP2005167098A	2005-06-23
JPH0730356A	1995-01-31
JP2003078377A	2003-03-14
JP2007019891A	2007-01-25

YAMAMOTO TOSHINORI (JP)
Toshinori Yamamoto (JP)

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