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Patent Searching and Data


Title:
ELECTRONIC SYSTEM, CAMERA MODULE, AND SYSTEM ON CHIP
Document Type and Number:
WIPO Patent Application WO/2022/021194
Kind Code:
A1
Abstract:
An electronic system (200), a camera module (190, 210), an SoC (110, 220), and an electronic device (100). The camera module (210) comprises a first bidirectional interface (2101); the SoC (220) comprises a second bidirectional interface (2201); the second bidirectional interface (2201) is coupled to the first bidirectional interface (2101); moreover, the first bidirectional interface (2101) and the second bidirectional interface (2201) both support the same bidirectional data communication interface protocol; the camera module (190, 210) can obtain image data and perform first image processing on the image data to obtain a first image processing result; and the SoC (110, 220) can perform second image processing on the first image processing result to obtain a second image processing result. Therefore, by using a bidirectional interface (2101, 2201) supporting the bidirectional data communication interface protocol to connect the camera module (210) and the SoC (220), the present application can improve the flexibility of an interface between the camera module (190, 210) and the SoC (110, 220), thereby facilitating flexibly processing image data by the camera module (190, 210).

Inventors:
LI BING (CN)
SUN JIANJIE (CN)
FAN MAOBIN (CN)
WANG HONGLI (CN)
MA PENGWEI (CN)
Application Number:
PCT/CN2020/105738
Publication Date:
February 03, 2022
Filing Date:
July 30, 2020
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06T3/40
Foreign References:
CN108986028A2018-12-11
CN101031068A2007-09-05
CN109391788A2019-02-26
CN109784125A2019-05-21
CN110310175A2019-10-08
US20200043135A12020-02-06
Other References:
See also references of EP 4184423A4
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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