Title:
ELECTRONICS MODULE COMPRISING A DEVICE FOR DISSIPATING HEAT GENERATED BY A SEMICONDUCTOR UNIT IN A PLASTIC HOUSING, AND METHOD FOR THE PRODUCTION OF AN ELECTRONICS MODULE
Document Type and Number:
WIPO Patent Application WO/2015/193129
Kind Code:
A9
Abstract:
The invention relates to an electronics module comprising a semiconductor unit (14) in a plastic housing (12), and an electrically conductive plate arrangement (16) via which the semiconductor unit (14) can be supplied with electric power and which is connected in a planar manner to a heat-generating integrated circuit (14b) of the semiconductor unit (14) via a heat coupling element (18), the electrically conductive plate arrangement (16) being designed in such a way as to dissipate the heat generated by the heat-generating integrated circuit (14b) of the semiconductor unit (14) to the plastic housing (12). The invention further relates to a method for producing a corresponding electronics module.
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Inventors:
SCHNEIDER THOMAS (DE)
Application Number:
PCT/EP2015/062635
Publication Date:
June 22, 2017
Filing Date:
June 08, 2015
Export Citation:
Assignee:
BOSCH GMBH ROBERT (DE)
International Classes:
H01L23/433; H01L23/495
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