ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

Title:

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2019/223499

Kind Code:

A1

Abstract:

Embodiments of the present invention provide an electroplating apparatus for electroplating on a surface of a wafer, the electroplating apparatus comprising a plurality of electrodes, the plurality of electrodes forming electric fields on the surface of the wafer, wherein an independent electric field is formed in a designated area, the intensity of the independent electric field is independently controlled, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch within the designated area is reduced. Embodiments of the present invention also provide an electroplating method for electroplating on a surface of a wafer by using a plurality of electrodes, the method controlling the plurality of electrodes to form electric fields on the surface of the wafer, wherein an independent electric field is formed in a designated area, the intensity of the independent electric field is independently controlled, when a notch of the wafer is positioned within the designated area, a total amount of power received by the notch within the designated area is reduced. The electroplating apparatus and the electroplating method of the present invention control the electroplating height of the notch of the wafer by directly controlling the intensity of the electric field. Compared with a conventional control method which only changing the rotation speed of the wafer, the present invention is more accurate and reliable, the electroplating efficiency is also increased.

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Inventors:

JIA ZHAOWEI (CN)
WANG JIAN (CN)
WANG HUI (CN)
YANG HONGCHAO (CN)

Application Number:

PCT/CN2019/084880

Publication Date:

November 28, 2019

Filing Date:

April 29, 2019

Export Citation:

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Assignee:

ACM RES SHANGHAI INC (CN)

International Classes:

C25D7/12; C25D17/10

Foreign References:

US20050067290A1	2005-03-31
US5382803A	1995-01-17
CN101265606A	2008-09-17
CN106480491A	2017-03-08
CN107208299A	2017-09-26

Attorney, Agent or Firm:

SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)

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