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Patent Searching and Data


Title:
ELECTROPLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2017/150666
Kind Code:
A1
Abstract:
Provided is an electroplating apparatus capable of suppressing occurrence of a non-plated region when forming an alloy plating layer on the surface of a thread of a steel pipe. An electroplating apparatus (10) includes: an electrode (1); sealing members (2, 3); and a plating solution supply unit (4). The electrode (1) faces a thread (Tm). The sealing member (2) is disposed in a steel pipe (P1). The sealing member (3) is attached to a pipe end portion of the steel pipe (P1), and forms a housing space (8) together with the sealing member (2). The plating solution supply unit (4) includes a plurality of nozzles (42). The nozzles (42) are arranged about the pipe axis of the steel pipe (P1) in the housing space (8) on one end side of the thread (Tm). The plating solution supply unit (4) ejects a plating solution from the nozzles (42) to a region between the thread (Tm) and the electrode (1). The ejection direction of the plating solution from each of the nozzles (42) is inclined toward the thread (Tm) at an angle of larger than 20 degrees and smaller than 90 degrees with respect to a plane orthogonal to the pipe axis.

Inventors:
KIMOTO MASANARI (JP)
ISHII KAZUYA (JP)
OSHIMA MASAHIRO (JP)
Application Number:
JP2017/008279
Publication Date:
September 08, 2017
Filing Date:
March 02, 2017
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C25D5/02; C25D7/04; C25D17/00; C25D21/10
Domestic Patent References:
WO2014007090A12014-01-09
Foreign References:
JPH0382792A1991-04-08
Other References:
See also references of EP 3425089A4
Attorney, Agent or Firm:
UEBA, Hidetoshi (JP)
Hidetoshi Ueha (JP)
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