ELECTROPLATING APPARATUS

WIPO Patent Application WO/2023/040465

A1

Disclosed is an electroplating apparatus, comprising a process chamber, a paddle board and a driving mechanism. The driving mechanism is used to drive the paddle board to move back and forth, so that the paddle board stirs an electroplating solution in the process chamber when a substrate is electroplated. The electroplating apparatus further comprises a cleaning assembly and a connecting bracket. The cleaning assembly is used to spray a cleaning solution on the electroplated substrate. One end of the connecting bracket is connected to the paddle board, and the other end of the connecting bracket is connected to the driving mechanism. The driving mechanism drives the paddle board by means of the connecting bracket to move back and forth. The connecting bracket is provided with a hollowed-out region, and the cleaning solution sprayed on the substrate is collected after passing through the hollowed-out region. Therefore, the present invention has the advantage of preventing the dilution of the electroplating solution.

WANG JIAN (CN)
WANG CHEN (CN)
YANG HONGCHAO (CN)
LU CHENHUA (CN)
LI JIAQI (CN)
JIA ZHAOWEI (CN)
QIN LING (CN)
WANG HUI (CN)

PCT/CN2022/107509

March 23, 2023

July 22, 2022

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ACM RES SHANGHAI INC (CN)

C25D7/12; C25D5/48; C25D17/00; C25D21/00; H01L21/02; H01L21/67

CN111593391A	2020-08-28
CN207148520U	2018-03-27
TW201145368A	2011-12-16
JP2000150365A	2000-05-30
CN112242297A	2021-01-19
CN105304522A	2016-02-03
CN213716844U	2021-07-16

SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)

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