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Patent Searching and Data


Title:
ELECTROPLATING ASSEMBLY MECHANISM
Document Type and Number:
WIPO Patent Application WO/2019/127014
Kind Code:
A1
Abstract:
An electroplating assembly mechanism comprises an electroplating drum (3). The electroplating drum (3) has a circular drum body (31), a rotary shaft (32), an engagement portion (33), and a plurality of vortex blades (37). A first end (321) of the rotary shaft (32) is provided at the circular drum body (31). The engagement portion (33) is provided at a bottom portion of the circular drum body (31), and is driven to rotate by a driving device. The vortex blades (37) are provided at the bottom portion of the circular drum body (31).

Inventors:
HUANG POTAO (CN)
LIU YAOCHUNG (CN)
Application Number:
PCT/CN2017/118619
Publication Date:
July 04, 2019
Filing Date:
December 26, 2017
Export Citation:
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Assignee:
HALLMARK TECH CO LTD (CN)
International Classes:
C25D17/18
Foreign References:
US3359195A1967-12-19
CN101139732A2008-03-12
CN102277613A2011-12-14
JP5672717B22015-02-18
JP2009065005A2009-03-26
JPH11279800A1999-10-12
CN106884198A2017-06-23
Other References:
See also references of EP 3733934A4
Attorney, Agent or Firm:
SHANGHAI ESSEN PATENT&TRADEMARK OFFICE (CN)
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