Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ELECTROPLATING BATH COMPOSITION AND METHOD OF USING
Document Type and Number:
WIPO Patent Application WO2001083854
Kind Code:
A3
Abstract:
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to cooper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper eletroplating bath composition, the incidence of voids in the interconnect structures is reduced.

More Like This:
JPH08199385ELECTROPLATING
JPH1018080FORMATION OF METALLIC CONDUCTIVE LAYER ON SURFACE OF FLUORINE PLASTIC BODY
Inventors:
HONG KIMIN (US)
BAXTER NATHAN E (US)
DUBIN VALERY M (US)
Application Number:
PCT/US2001/012348
Publication Date:
October 03, 2002
Filing Date:
April 10, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
INTEL CORP (US)
HONG KIMIN (US)
BAXTER NATHAN E (US)
DUBIN VALERY M (US)
International Classes:
C25D3/38; C25D5/18; C25D7/12; (IPC1-7): C25D3/38; C25D5/18; C25D7/12
Domestic Patent References:
WO2000014306A12000-03-16
WO2000041518A22000-07-20
WO1999040615A11999-08-12
Foreign References:
US20010015321A12001-08-23
US4555315A1985-11-26
EP1054080A22000-11-22
DE2025538A11971-10-21
US4975159A1990-12-04
EP1122989A22001-08-08
US5849171A1998-12-15
EP0862665A11998-09-09
US6129830A2000-10-10
EP1069210A12001-01-17
EP1111096A22001-06-27
EP1069212A12001-01-17
EP1026286A22000-08-09
US5232575A1993-08-03
EP1132500A22001-09-12
DE19952273A12000-05-11
US4058439A1977-11-15
EP0982771A12000-03-01
Other References:
J.J. KELLY, C. TIAN AND A.C. WEST: "Leveling and microstructural effects of additives for copper electrodeposition", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 146, no. 7, 1999, pages 2540 - 2545, XP002208511
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 12 3 January 2001 (2001-01-03)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD AND DEVICE FOR TREATING CONTAMINATED COATING COMPOSITIONS

Next Patent: SURFACE TREATMENT OF PARTS OF DIE-CAST AND EXTRUSION MACHINES