Title:
ELECTROPLATING BATH, METHOD FOR FORMING ELECTROPLATING COATING, AND ELECTROPLATED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2012/053283
Kind Code:
A1
Abstract:
The present invention provides an electroplating bath with which an electroplating Fe-W alloy coating may be formed. The elemental composition of the electroplating coating (energy dispersive X-ray spectroscopy, same hereafter) is W: 2 to 70%, Mn: 0.05 to 1.0%, S: 0.1 to 8%, and Fe: the remainder. The electroplating coating contains a water soluble S-containing compound along with 1) water soluble Fe (II, III) salt, 2) water soluble W (VI) acid salt, and 3) water soluble Mn (II) salt. An electroplating coating (15) is formed on a base material (11) on which an underlayer plating (13) has been applied, after which heating treatment (post processing) is performed at a temperature of 200 to 1000°C to form an electroplating coating (15A).
Inventors:
WATABE KIYOHIKO (JP)
ITO KAZUO (JP)
ITO KAZUO (JP)
Application Number:
PCT/JP2011/069419
Publication Date:
April 26, 2012
Filing Date:
August 29, 2011
Export Citation:
Assignee:
YUKEN KOGYO CO LTD (JP)
WATABE KIYOHIKO (JP)
ITO KAZUO (JP)
WATABE KIYOHIKO (JP)
ITO KAZUO (JP)
International Classes:
C25D3/56; C25D7/00
Domestic Patent References:
WO2010055825A1 | 2010-05-20 |
Foreign References:
JPS53103937A | 1978-09-09 | |||
JPH06246510A | 1994-09-06 | |||
JPH04269534A | 1992-09-25 | |||
JP2007525600A | 2007-09-06 | |||
JPS5396933A | 1978-08-24 | |||
JP2002507666A | 2002-03-12 | |||
JP2002194586A | 2002-07-10 | |||
JPH03236492A | 1991-10-22 |
Attorney, Agent or Firm:
IIDA, Akio et al. (JP)
Akio Iida (JP)
Akio Iida (JP)
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