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Patent Searching and Data


Title:
ELECTROPLATING DEVICE AND ELECTROPLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/015672
Kind Code:
A1
Abstract:
The present application provides an electroplating device and an electroplating apparatus. The electroplating device comprises a driving mechanism, a mounting part drivingly connected to the driving mechanism and made of a conductive material, and a plurality of clamps fixedly mounted on the mounting part; the plurality of clamps is made of the conductive material, and each clamp is electrically connected to the mounting part and is configured to clamp a circuit board; the mounting part is suspended above an electroplating tank; the driving mechanism is configured to drive the mounting part to drive the clamp and the circuit board to move together, and to enable the circuit board to move into the electroplating tank.

Inventors:
CHAN WALLACE (CN)
Application Number:
PCT/CN2019/096332
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
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Assignee:
UNIVERSAL CIRCUIT BOARD EQUIPMENT CO LTD (CN)
International Classes:
C25D17/00; C25D17/06; C25D21/10; H05K3/18
Foreign References:
CN206204458U2017-05-31
CN206204458U2017-05-31
CN105648512A2016-06-08
CN105648512A2016-06-08
CN205529125U2016-08-31
CN205529125U2016-08-31
CN107955962A2018-04-24
CN107955962A2018-04-24
CN204874806U2015-12-16
CN204874806U2015-12-16
CN108823630A2018-11-16
CN208857382U2019-05-14
CN208562567U2019-03-01
CN205616981U2016-10-05
CN205616984U2016-10-05
CN203926398U2014-11-05
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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