Title:
ELECTROPLATING DEVICE FOR SMALL COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/121526
Kind Code:
A1
Abstract:
Disclosed in the present invention is an electroplating device for a small component. The electroplating device for a small component comprises one or more electroplating units. Each electroplating unit is provided with an electroplating roller, an electroplating tank, a driver, and a movable frame. The driver is disposed in the electroplating tank, and is used for the electroplating roller to intermittently rotate. The movable frame is disposed on one top of the electroplating tank. The electroplating roller can be taken away from the electroplating tank by moving the movable frame, and is placed into another electroplating tank, and the number of the electroplating tanks can be expanded to be greater than one, so as to achieve the objective of continuous production.
Inventors:
HUANG POTAO (CN)
LIU YAOCHUNG (CN)
LIU YAOCHUNG (CN)
Application Number:
PCT/CN2017/118615
Publication Date:
July 05, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
HALLMARK TECH CO LTD (CN)
International Classes:
C25D17/22
Foreign References:
| JPH08239799A | 1996-09-17 | |||
| JP2002322591A | 2002-11-08 | |||
| US5487824A | 1996-01-30 | |||
| CN1576400A | 2005-02-09 |
Other References:
See also references of EP 3578694A4
Attorney, Agent or Firm:
SHANGHAI ESSEN PATENT & TRADEMARK OFFICE (CN)
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