ELECTROPLATING METHOD FOR CIRCUIT BOARD, AND CIRCUIT BOARD

WIPO Patent Application WO/2023/060773

A1

The present application relates to the technical field of circuit boards. Specifically disclosed are an electroplating method for a circuit board, and a circuit board. The electroplating method for a circuit board comprises: subjecting a circuit board to be electroplated to a primary treatment so as to form a blind hole on the surface of one side of the circuit board; subjecting the circuit board, which has undergone the primary treatment, to primary electroplating by means of an electroplating solution and an additive, wherein the electroplating solution comprises an electroplating agent and an accelerator; subjecting the circuit board, which has undergone the primary electroplating, to primary electrolysis so as to remove the accelerator, which is adsorbed on the surface of one side of the circuit board after electroplating, and reserving the accelerator adsorbed on the bottom of the blind hole and part of a side wall; and subjecting the circuit board, which has undergone the primary electrolysis treatment, to secondary electroplating. According to the method, by means of the electroplating method for a circuit board in the present application, the electroplating hole filling efficiency can be effectively improved so as to shorten the hole filling time, and the blind hole of the circuit board can also be effectively filled.

ZHU KAI (CN)
MIAO HUA (CN)

PCT/CN2021/142198

April 20, 2023

December 28, 2021

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SHENNAN CIRCUITS CO LTD (CN)

H05K3/18; C25D5/02; C25D5/34

US20110180412A1	2011-07-28
CN1551295A	2004-12-01
US7405163B1	2008-07-29
CN101775601A	2010-07-14
CN1291775A	2001-04-18
JP2009228124A	2009-10-08

CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)

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