Title:
ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2008/041516
Kind Code:
A1
Abstract:
The surface of a metal base is electroplated by utilizing an induction codeposition phenomenon
using at least one of carbon dioxide and inert gas, an electroplating liquid containing
a metal powder dispersed therein, and a surfactant in a supercritical state or
a subcritical state. The concentration of the metal in the electroplating liquid
is in a saturated or supersaturated state. Accordingly, the dissolution speed
of the metal base can be suppressed, and, at the same time, a plating layer having
a smooth surface can be formed in a short time by utilizing an induction codeposition
phenomenon. The electroplating method can be applied even when the metal base
is formed of a metallic thin film provided on a surface of an insulating film provided
on the substrate, or even when the metal is copper, zinc, iron, nickel, or cobalt.
The above constitution can provide an electroplating method which, in electroplating
on the surface of a metal base, can prevent the dissolution of the metal base to
realize normal electroplating even in the case of a very thin metal base.
Inventors:
MIYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
Application Number:
PCT/JP2007/068380
Publication Date:
April 10, 2008
Filing Date:
September 21, 2007
Export Citation:
Assignee:
SES CO LTD (JP)
MYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
MYATA SEIZO (JP)
SHIMIZU TETSUYA (JP)
TAJIMA HISAYOSHI (JP)
SONE MASATO (JP)
International Classes:
C25D5/00; C25D7/12
Foreign References:
| JPH08158097A | 1996-06-18 | |||
| JP2003321798A | 2003-11-14 | |||
| JP2001123291A | 2001-05-08 | |||
| JPH10237685A | 1998-09-08 | |||
| JPH10330987A | 1998-12-15 | |||
| JP2003096596A | 2003-04-03 | |||
| JP2005259959A | 2005-09-22 | |||
| JP2003321798A | 2003-11-14 | |||
| JP2005154816A | 2005-06-16 | |||
| JPH07268696A | 1995-10-17 |
Attorney, Agent or Firm:
WIN TECH PATENT OFFICE (Uchikanda-Shibuya Bldg.16-11, Uchikanda 2-chom, Chiyoda-ku Tokyo 47, JP)
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