ELECTROPLATING SOLUTION COMPOSITION FOR ORGANIC POLYMER-ZINC ALLOY COMPOSITE PLATING AND PLATED METAL MATERIAL USING SUCH COMPOSITION

WIPO Patent Application WO/2005/056884

A1

Disclosed is an electroplating solution composition which enables to obtain a plating with excellent corrosion resistance which exhibits excellent adhesion with a coating film without being subjected to a surface treatment. Such an electroplating solution composition for an organic polymer-zinc alloy composite plating is characterized by containing (A) 1-600 g/l of Zn ions, (B) 1-600 g/l of iron group element ions, (C) 0.1-200 g/l of a tungstic acid compound as W ions and (D) 0.5-500 g/l of a water-soluble or water-dispersible organic polymer compound having a number-average molecular weight of 1,000-1,000,000.

JP2005325385	BRIGHT PLATED FILM WITH TIN-BISMUTH ALLOY FOR ELECTRONIC PARTS SUCH AS CONNECTOR AND SEMICONDUCTOR PARTS, AND BRIGHT PLATING BATH OF TIN-BISMUTH ALLOY FOR ELECTRONIC PARTS SUCH AS CONNECTOR AND SEMICONDUCTOR PARTS
JPH07305199	ZN-NI ALLOY PLATING METHOD
JPS62136590	PRODUCTION OF ZN-NI ALLOY PLATED STEEL SHEET

KUBOTA KENTARO
HARUTA YASUHIKO
HIRAKI TADAYOSHI

PCT/JP2004/018543

June 23, 2005

December 07, 2004

Click for automatic bibliography generation  

KANSAI PAINT CO LTD (JP)
KUBOTA KENTARO
HARUTA YASUHIKO
HIRAKI TADAYOSHI

C25D3/56; C25D5/26; C25D15/02; (IPC1-7): C25D5/26; C25D3/56; C25D15/02

WO2002052068A1

2002-07-04

JPS4911735A	1974-02-01
JP2001254195A	2001-09-18
JPH05195244A	1993-08-03
JPH03162598A	1991-07-12
JPS4716522B1
JPH08246184A	1996-09-24
JP2000309897A	2000-11-07

See also references of EP 1719826A4

Oguri, Shohei (13th Floor ARK Mori Building, 12-32, Akasaka 1-chome, Minato-k, Tokyo 13, JP)

View/Download PDF      PDF Help

Previous Patent: METHOD OF MANUFACTURING THIN CONDUCTORS ON A CARRIER WEB AND THE CONDUCTOR MANUFACTURED WITH THIS ME...

Next Patent: METAL-PLATED STEEL SHEET FOR BATTERY CASE, BATTERY CASE USING THE PLATED STEEL SHEET FOR BATTERY CAS...