Title:
ELECTROPLATING SOLUTION AND ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/193696
Kind Code:
A1
Abstract:
An electroplating solution comprising (A) a soluble salt containing at least a first tin salt, (B) an acid or a salt thereof, and (C) a surfactant. When electrolysis is carried out at an anodic current density of 0.7 A/dm2, the maximum value of the particle size distribution of air bubbles released from an insoluble anode is 150 μm or more. It is preferred that the surfactant (C) is a nonionic surfactant comprising a polyoxyethylene-polyoxypropylene block polymer (PO-EO-PO) of which the terminal is polyoxypropylene (PO), the proportion of EO in the block polymer (PO-EO-PO) is 35 to 50% by mol, inclusive, and the mass average molecular weight of the nonionic surfactant is 3000 to 5000, inclusive.
Inventors:
TATSUMI KOJI (JP)
Application Number:
PCT/JP2021/012153
Publication Date:
September 30, 2021
Filing Date:
March 24, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/32; C25D3/60; C25D7/00; C25D7/12
Foreign References:
| JP2018162512A | 2018-10-18 | |||
| JP2019163507A | 2019-09-26 | |||
| JP2015092021A | 2015-05-14 | |||
| JPH06240489A | 1994-08-30 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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