Title:
ELECTROSTATIC CHUCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/060205
Kind Code:
A1
Abstract:
This electrostatic chuck device 80 is sequentially provided, in the following order, with: an electrostatic chuck part 2 that has one main surface serving as a stage surface on which a plate-like sample is placed, while containing an internal electrode for electrostatic suction inside; a first bonding layer 4; a sheet material 6; a second bonding layer 8; and a base part 10 for temperature regulation, which regulates the temperature of the electrostatic chuck part 2 to a desired temperature. The first bonding layer 4 comprises a joining layer 14 that has a thickness of 1-500 nm and a silicone adhesive layer 24 that has a thickness of 2-30 μm. The second bonding layer 8 comprises a joining layer 18 that has a thickness of 1-500 nm and a silicone adhesive layer 28 that has a thickness of 2-30 μm.
Inventors:
ITO TOMOMI (JP)
MIURA YUKIO (JP)
MIURA YUKIO (JP)
Application Number:
PCT/JP2015/079188
Publication Date:
April 21, 2016
Filing Date:
October 15, 2015
Export Citation:
Assignee:
SUMITOMO OSAKA CEMENT CO LTD (JP)
International Classes:
H01L21/683
Foreign References:
| JP2009054932A | 2009-03-12 | |||
| JP2008282875A | 2008-11-20 | |||
| JP2013074251A | 2013-04-22 |
Attorney, Agent or Firm:
OHTANI, Tamotsu (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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