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Title:
ELECTROSTATIC CHUCK DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/095596
Kind Code:
A1
Abstract:
This electrostatic chuck device comprises: an electrostatic chuck plate having a dielectric substrate provided with a mounting surface on which a sample is placed, and an adsorption electrode positioned inside the dielectric substrate; and a base supporting the electrostatic chuck plate from the side opposite to the mounting surface. The electrostatic chuck plate is provided with a first through-hole that supplies gas to the mounting surface, and a porous body that allows the gas to pass therethrough is inserted in the first through-hole. A first adhesive layer that adheres the inner circumferential surface of the first through-hole and the outer circumferential surface of the porous body together is provided between the inner circumferential surface and the outer circumferential surface. The thickness dimension of the first adhesive layer is 0-0.15 mm in at least a region up to 0.1 mm from the mounting surface.

Inventors:
MAEDA KEISUKE (JP)
MORISHITA NORITO (JP)
ITAGAKI TETSURO (JP)
YOSHIOKA YOSHIKI (JP)
Application Number:
PCT/JP2022/041363
Publication Date:
June 01, 2023
Filing Date:
November 07, 2022
Export Citation:
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Assignee:
SUMITOMO OSAKA CEMENT CO LTD (JP)
International Classes:
H01L21/683; H02N13/00
Domestic Patent References:
WO2020242661A12020-12-03
WO2020153449A12020-07-30
Foreign References:
JP2013232640A2013-11-14
JP2021093436A2021-06-17
JP2005268654A2005-09-29
US20210118716A12021-04-22
JP2020145280A2020-09-10
JP2018101773A2018-06-28
JP2006344766A2006-12-21
JP2021057468A2021-04-08
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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