Title:
ELECTROSTATIC CHUCK AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/096267
Kind Code:
A1
Abstract:
Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E + 16 to 1.0E + 17 Ω·cm.
Inventors:
KIM YUN HO (KR)
KIM JOO HWAN (KR)
LEE KI RYONG (KR)
KIM JOO HWAN (KR)
LEE KI RYONG (KR)
Application Number:
PCT/KR2019/014528
Publication Date:
May 14, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
KSM COMPONENT CO LTD (KR)
International Classes:
H01L21/683; C04B35/10; C04B35/626; C04B35/638; H01L21/304
Foreign References:
| JP2016124734A | 2016-07-11 | |||
| JP2011136877A | 2011-07-14 | |||
| KR101769608B1 | 2017-08-21 | |||
| KR20050067085A | 2005-06-30 | |||
| US20130285336A1 | 2013-10-31 | |||
| KR20180136671A | 2018-12-26 |
Other References:
See also references of EP 3792964A4
Attorney, Agent or Firm:
KIM, Sung Ho (KR)
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