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Patent Searching and Data


Title:
ELECTROSTATIC CHUCK AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/105236
Kind Code:
A1
Abstract:
The present invention provides an electrostatic chuck and a semiconductor device. The electrostatic chuck comprises: a supporting component comprising a base; a chuck disposed on the base and used for supporting a workpiece to be processed; and a fastening component used for detachably fixing the chuck on the base. According to the electrostatic chuck provided in the present invention, a chuck body can be conveniently dissembled and replaced, and limits to the electrical property of other parts contacting with the chuck body are lifted. Meanwhile, the chuck is not required to be welded with ceramics in other materials, so the process difficulty and cost are reduced. Moreover, the single material can improve the stability of the electrical property, reduce the difference, and facilitate designing the shape and the size of the chuck, thereby improving the strength and the process.

Inventors:
SHI QUANYU (CN)
SHI SHUAITAO (CN)
ZHAO MENGXIN (CN)
ZHAO JINRONG (CN)
Application Number:
PCT/CN2018/115667
Publication Date:
June 06, 2019
Filing Date:
November 15, 2018
Export Citation:
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Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/687; H01L21/683
Foreign References:
CN107808848A2018-03-16
CN1941317A2007-04-04
JP2000277597A2000-10-06
JP2000277598A2000-10-06
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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