Title:
ELECTROSTATIC CHUCK AND SEMICONDUCTOR PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/156463
Kind Code:
A1
Abstract:
An electrostatic chuck and a semiconductor processing device, the electrostatic chuck comprising an insulating layer (1) and a temperature adjustment structure (2), wherein the insulating layer (1) is provided with a direct current electrode (11) used for the electrostatic adsorption of a wafer placed on the insulating layer (1); the temperature adjustment structure (2) comprises an insulating base (21) provided at the bottom part of the insulating layer (1); the insulating base (21) is provided with a heat exchange component (22) suspended from the ground; the heat exchange component (22) comprises a contact surface (221) exposed from the upper surface of the insulating base (21); and the contact surface (221) is in contact with the lower surface of the insulating layer (1) for use in controlling the temperature of the wafer by means of heat conduction. The electrostatic chuck and the semiconductor processing device may reduce the capacitance-to-ground of the direct current electrode (11) so as to reduce the power loss on the capacitance-to-ground and increase the process efficiency.
Inventors:
WANG GUIBIN (CN)
WEI GANG (CN)
WEI GANG (CN)
Application Number:
PCT/CN2021/139936
Publication Date:
July 28, 2022
Filing Date:
December 21, 2021
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/683; H01J37/32; H01L21/67
Foreign References:
| CN112864079A | 2021-05-28 | |||
| CN104701126A | 2015-06-10 | |||
| CN111261571A | 2020-06-09 | |||
| JP2017199851A | 2017-11-02 | |||
| US5452510A | 1995-09-26 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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