Title:
ELECTROSTATIC CHUCK AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/038785
Kind Code:
A1
Abstract:
Provided are an electrostatic chuck and a substrate processing device with which in-plane uniformity of the temperature of a substrate is improved. The electrostatic chuck comprises: a dielectric layer having a substrate support surface; and a chuck electrode layer. The substrate support surface includes a plurality of point-like protrusions and a ring-shaped protrusion surrounding the plurality of point-like protrusions. The ring-shaped protrusion has an inner circumferential wall and an outer circumferential wall. The inner circumferential wall extends over the entire circumference along a first circle in plan view. The outer circumferential wall includes: a circular arc portion extending along part of a second circle that is larger than the first circle in plan view; and a cutout portion extending linearly between both ends of the circular arc portion in plan view. The chuck electrode layer is disposed in the dielectric layer so as to overlap with the ring-shaped protrusion over the entire circumference thereof in plan view.
Inventors:
SASAKI YASUHARU (JP)
Application Number:
PCT/JP2023/028684
Publication Date:
February 22, 2024
Filing Date:
August 07, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; C23C16/458; H01L21/3065
Foreign References:
| JP2002270681A | 2002-09-20 | |||
| JP2016139650A | 2016-08-04 | |||
| US20030211757A1 | 2003-11-13 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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