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Title:
ELECTROSTATIC IMPREGNATION OF POWDERS ON SUBSTRATES
Document Type and Number:
WIPO Patent Application WO2002002245
Kind Code:
A3
Abstract:
Electrostatic Impregnation Of Powders On SubstratesThe use of electrostatic impregnation to load materials such as binders and flavors onto substrates such as fibers and medical devices is disclosed. Substrates loaded with materials such as binders and flavors, wherein the materials are loaded on the substrates via electrostatic impregnation are also disclosed.

Inventors:
DAVE VIPUL BHUPENDRA
Application Number:
PCT/US2001/018240
Publication Date:
May 16, 2002
Filing Date:
June 05, 2001
Export Citation:
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Assignee:
JOHNSON & JOHNSON CONSUMER (US)
International Classes:
B32B7/02; A61C15/04; A61L17/14; A61L27/54; A61L31/16; B05D1/06; B29B15/10; B32B27/00; D06M10/02; D06M10/10; D06M15/05; D06M15/09; D06M15/227; D06M15/507; D06M15/53; D06M15/693; D06M23/08; D06M101/18; D06M101/22; D06M101/32; D06M101/34; (IPC1-7): D06M10/08; D06M10/10; B05D1/04
Domestic Patent References:
WO1992015404A11992-09-17
WO1996032529A11996-10-17
Foreign References:
GB956564A1964-04-29
GB2190927A1987-12-02
US4345907A1982-08-24
Other References:
See also references of EP 1299590A2
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