Title:
ELEMENT-CONTAINING PACKAGE AND MODULE PROVIDED THEREWITH
Document Type and Number:
WIPO Patent Application WO/2012/026516
Kind Code:
A1
Abstract:
An element-containing package based on one of the aspects of the present invention is provided with: a metal substrate, the top surface of which has a placement region in which a semiconductor element is placed; a frame provided on the top surface of the metal substrate so as to surround said placement region; an I/O member that is inserted between the metal substrate and the frame and comprises a ceramic substrate and a plurality of wiring conductors provided on the top surface of said ceramic substrate; and a brazing material that is located between the metal substrate and the I/O member and joins said metal substrate and I/O member. The metal substrate has a recess formed in an area that is inside the region surrounded by the frame on the top surface and, at least, vertically overlaps the periphery of the I/O member.
Inventors:
FUJIWARA HIRONOBU (JP)
Application Number:
PCT/JP2011/069145
Publication Date:
March 01, 2012
Filing Date:
August 25, 2011
Export Citation:
Assignee:
KYOCERA CORP (JP)
FUJIWARA HIRONOBU (JP)
FUJIWARA HIRONOBU (JP)
International Classes:
H01L23/02; H01L23/04
Foreign References:
| JP2004095596A | 2004-03-25 | |||
| JP2002134763A | 2002-05-10 | |||
| JP2003046015A | 2003-02-14 | |||
| JP2001168220A | 2001-06-22 |
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Claims: