Title:
ELEMENT CONTAINING PACKAGE, MODULE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/043623
Kind Code:
A1
Abstract:
An element containing package according to one embodiment of the present invention comprises: a base body having on the upper surface thereof a placement region on which a semiconductor element is placed; a frame body disposed on the upper surface of the base body so as to surround the placement region and having an opening open at the inner surface and outer surface of the frame body; and a tube-shaped stationary member having a first portion which is affixed to the inner peripheral surface of the opening or to the outer surface of the frame body so as to be located around the opening, the tube-shaped stationary member also having a second portion which is located further toward the outside of the frame body than the first portion and to which a ferrule is affixed. The stationary member has a portion having a smaller thickness than the second portion, and the portion is located between the first portion and the second portion.
Inventors:
SHIBAYAMA HIROSHI (JP)
FUJIWARA HIRONOBU (JP)
MIYAHARA MANABU (JP)
FUJIWARA HIRONOBU (JP)
MIYAHARA MANABU (JP)
Application Number:
PCT/JP2011/072172
Publication Date:
April 05, 2012
Filing Date:
September 28, 2011
Export Citation:
Assignee:
KYOCERA CORP (JP)
SHIBAYAMA HIROSHI (JP)
FUJIWARA HIRONOBU (JP)
MIYAHARA MANABU (JP)
SHIBAYAMA HIROSHI (JP)
FUJIWARA HIRONOBU (JP)
MIYAHARA MANABU (JP)
International Classes:
G02B6/42; H01L23/02; H01L31/0232; H01S5/022
Foreign References:
| JP2007234638A | 2007-09-13 |
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Claims: