ELEMENT MOUNTING SUBSTRATE, SEMICONDUCTOR MODULE, CAMERA MODULE, AND METHOD FOR PRODUCING ELEMENT MOUNTING SUBSTRATE

WIPO Patent Application WO/2011/080952

A1

An element mounting substrate (210) on which chip parts (220) are mounted is provided with an opening (300) corresponding to an area for installing a semiconductor element (120). A transparent member (310) is fitted in the opening (300), and a side surface at the outer periphery of the transparent member (310) is fixed, by an adhesive (320), to an inner wall of the element mounting substrate (210) exposing to the opening (300). Further, a second element mounting substrate (210) mounted with a lens (290) and chip parts (220) is laminated on a first element mounting substrate (110) mounted with a semiconductor element (120), through a solder ball (270). The second element mounting substrate (210) is provided with an opening (300) corresponding to an area for installing the semiconductor element (120). A transparent member (310) is fitted in the opening (300), and the outer periphery of the transparent member (310) is fixed, by an adhesive (320), to an inner wall of the second element mounting substrate (210) exposing to the opening (300).

USUI RYOSUKE (JP)
NAKASATO MAYUMI (JP)
TABATA OSAMU (JP)

PCT/JP2010/067120

July 07, 2011

September 30, 2010

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SANYO ELECTRIC CO (JP)
USUI RYOSUKE (JP)
NAKASATO MAYUMI (JP)
TABATA OSAMU (JP)

H04N5/335; G02B7/02; H01L27/14; H01L31/02; H04N5/225

JP2009239636A	2009-10-15
JP4374078B2	2009-12-02
JP2007142058A	2007-06-07
JP2009147664A	2009-07-02
JP2008148222A	2008-06-26

Hiroshi Sumiya (JP)
KADOYA HIROSHI (JP)

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